Automated Fiber Array Assembly Enabled by SmarAct’s Precision Systems

Discover how SmarAct's precision technology enhances fiber array assembly for optimal performance in photonic systems.

Alignment and Microassembly of Optical Components

Discover SmarAct's advanced systems for precise alignment and microassembly of optical components in high-tech applications.

OEM Laser Components

Discover our laser components designed for semiconductor and photonics industries, offering precision and reliability.

Fiber Alignment for Photonic Integrated Circuits

Ultra-fast, high-precision alignment of fibers to PICs right at the wafer-level.

Wafer Positioning

Discover high-precision wafer positioning for semiconductor manufacturing to enhance device performance and quality.

Wafer Alignment

Discover high-precision wafer alignment systems for semiconductor manufacturing, featuring advanced motion and metrology technologies.

EUV Lithography

Explore advanced positioning systems for EUV lithography. Achieve precision in harsh environments with SmarAct technology.

Lithography Mask Correction

Explore precision lithography mask correction with SmarAct's systems, ensuring nm-level accuracy for flawless integrated circuits.

Optical Assembly

Explore advanced optical assemblies with precision gripping and positioning systems for photonics applications.

Quantum Computing with Cryo Stages

Discover high-precision cryogenic positioning systems for quantum applications, ensuring optimal performance under extreme conditions.

Optical Characterization

Discover high-precision positioning and metrology solutions for testing micro displays and sensors at SmarAct.

FlyScan-Analysis

Discover the FlyScan-Analysis systems for quick data collection and precise sample analysis with synchronized position tracking.

Electrical Probing

Discover automated electrical probing solutions for semiconductors, including advanced technologies for precise measurements.

Vibrometry for MEMS

Discover how SmarAct's PicoScale Vibrometer measures MEMS vibrations through silicon packaging using IR confocal imaging technology.

Smarpod for State-Of-The-Art Pick-And-Place Activities

Institute of Photonics (IOP), University of Strathclyde UK