Measuring MEMS Vibrations Through a Packaging of Silicon

When MEMS are packaged in a silicon enclosure it is impossible to use conventional optical measurement methods to evaluate their dynamic performance without opening them up. The PICOSCALE Vibrometer utilizes an infrared measurement laser with a confocal detection scheme which opens the way to analyze the dynamics of a motion sensor through its enclosure of silicon.

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PICOSCALE Vibrometer for the modal analysis of small samples.

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SmarAct Metrology

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