Dispenser module

The dispenser module enables the automated application of defined quantities of adhesive or solder paste. This makes it possible to integrate different joining methods into the process sequence, such as bonding with UV-curable epoxy resin. The basic version has a pressure-time controlled dispenser. Other dispensing solutions are available depending on the media to be applied. The dispenser module is installed directly on the motion system so that the application of the joining material can be effectively integrated into the process. As a result, it can be used in addition to the handling module to implement even the most demanding joining operations.

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Niklas Böhmke

Technical Sales