With the increasing digitalization of our everyday life, the reliability of semiconductor devices is becoming more and more important. In order to improve reliability, semiconductor failure analysis determines the reason for observed failures during lifetime tests and feeds this information into the production process to correct the failure.
In the chain of analytical methods in failure analysis, nanoprobing is a key element in determining electrical defects. It can be used to characterize individual transistors, p/n junctions, and open and short circuits in conductors. The nanoprober is typically mounted in a scanning electron microscope (SEM) to bring the tungsten nanoprobes to the point of interest. The SMARPROBE nanoprobe was developed to make this process as efficient and with as little impact as possible on the device under test.