in Micro- and Nanotechnology
by SmarAct Metrology
Measuring Lateral Vibrations Within All-Silicon Loudspeakers
When MEMS are packaged in a silicon enclosure it is impossible to evaluate their dynamic performance with conventional optical methods without opening them up. Beyond the interferometric measurement of out-of-plane vibrations, the PICOSCALE Vibrometer allows the imaging of in-plane vibrations of encapsulated devices with infrared confocal microscopy.
